Robert and Jim,

Being new to this 'SMT' stuff, I would also be interested in following
this thread, here on the forum if appropriate and feasible.

Thanks.

Richard Hamilton
Clemar Mfg. / Rain Bird

> -----Original Message-----
> From: Furrow, Robert Gordon (Robert) [SMTP:[log in to unmask]]
> Sent: Monday, December 01, 1997 10:25 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Via in Pad for BGA
>
> Jim,
> I would be very interested in learning more about this process. Do you
> have several board suppliers that provide this for you? How much of a
> cost adder is it? What is the smallest hole that can be filled and
> plated over? Could you give me a more detailed explanation of the
> polyimide bonding? What type of product  has this process been used
> for
> (is it BellCore applicable)? Any further info you could give me would
> be
> greatly appreciated as we would like to fill and plate vias on some of
> our product. My email is [log in to unmask] and my phone is
> 978-960-3224.
> Thanks in advance,
> Robert Furrow
>
> >----------
> >From:  Jim Marsico 516-595-5879[SMTP:[log in to unmask]]
> >Sent:  Monday, December 01, 1997 10:21 AM
> >To:    [log in to unmask]
> >Subject:       Re: [TN] Via in Pad for BGA
> >
> >We do use via-in-pad technology for our BGA components.  Our boards
> are
> >designed, however, with a thin layer of polyimide which is bonded to
> the back
> >side of the multilayer board.  During the bonding process, the vias
> get
> >filled
> >with resin.  We then require our suppliers to copper plate over the
> resin
> >filled vias then solder coat.  The result is a solid surface mount
> pad with a
> >via inside which is undetectable.
> >
> >Jim Marsico
> >(516) 595-5879
> >[log in to unmask]
> ################################################

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