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December 1997

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 10 Dec 1997 11:37:44 -0600
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The IPC document for solder paste (actually it's a joint industry standard) is ANSI/J-STD-005. The new handbook for J-STD-001B "Requirements for Soldered Electrical and Electronic Assemblies" is J-HDBK-001. It has sections on screen and stencil printing. The handbook has been through all the approval processes and we are in the process of preparing the document for printing. It is projected to be published and available through our Customer Service Department early in the 1st quarter of 1998. Watch for it on the IPC Web Site http://www.ipc.org under the "Bookstore" link.

Thanks for using the TechNet!  Jack

Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask]        http://www.ipc.org
847-509-9700 x 393
fax 847-509-9798

>>> tana <[log in to unmask]> 12/10/97 10:56AM >>>
Dear Techneters,

I would like to know if there are any IPC standards/guidelines on
criteria used to qualify solder paste stencil printing. If there are
any, please point me to the right directions.

Thanks
Tennyson Nguty, AeroMech Department, Newton Building, Salford University
Manchester M5 4WT, UK. Tel: 0161-745 4696/5951, Fax: 0161-295 5575/5108

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