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December 1997

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Subject:
From:
Doug Pauls <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 1 Dec 1997 07:57:55 -0500
Content-Type:
text/plain
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text/plain (28 lines)
In a message dated 97-11-28 04:25:16 EST, you write:

>                I have a white resiude problem after aqueous assembley,
>  i know the solder resist manufacturer has changed his formulation, but I
>  would like to work with the solder resist manufacturer as the resist has
>  numerous advantages.

Sean,
Please provide more details.  At what point in the process do you see the
residues?  What do they look like?  How widespread are they or where on the
assembly to they occur?  What flux are you using?  What cleaning method are
you using?

Doug Pauls
CSL

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