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December 1997

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Subject:
Re: Under Develope of the Wet Film Solder Mask -Reply
From:
Sam Shoemaker <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 9 Dec 1997 19:41:15 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (60 lines) 
KW/Randy,

This is just a sampling of some of the responses on the Internet to Hong
Yuen's problem.

Really need to resolve.

sam

>>> "Hong Yuen Electronics Ltd." <[log in to unmask]> 12/08/97 >>>
At 10:23 PM 1997/12/7 EST, you wrote:
>Assuming your developing process is in spec, soldermask residue is
indicative
>of too high a temperature at tack cure; overexposure could also cause
the
>problem.
>
>Where is the residue?  Is it on the fiberglass or the copper or both?
>Give me your process parameters and I'll try to help.
>
>Mark Dowding
>Regional Technical Service Manager
>INSULECTRO
>
Our Process Parameters as follow : -
Pre Heat 15min for first side, 30min for second side, temp. 72 +/-
3degreeC
the residue was occured on the surface of the gold, especially on the
edge
of the hole,
also, the Stuffer Step is 10 - 12.
By the way, all the parameters we have used for more than one year.
Please advise

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