We are in the process of setting up a far east facility in Malaysia
which has high levels of ambient temperature and humidity.  I am unable
to find any specifications that define how raw circuits should be stored
to maintain soldrability apart from the vague term of cool and dry.  Is
there any information available which states what would be maximum
storage times at various temperatures and humidities with no special
pacakaging for cards, with a solder surface finish, that would maintain
acceptable solderability.

Are there any criteria with regard to packaging to extend the storage
time.  i.e type of dessicant, amount of dessicant, type of ESD bag
etc.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################