HI!  This was a question we had to deal with about 3 years ago.  We
had a solder reflowed socket with about 500 pins which
was used 4 time on one assembly.  The board was electroless Ni. Immersion
gold finished.
        Over 200 boards were produced this way and to date none have had a
problem.

        I understand that the Europeans do this with no problem.

        We did get the pins changed to gold plate because we didn't have time
to evaluate this combination.

        However, today with the field results of "no problem" I would do it
again!

        It makes sense that with as little gold as is in the hole, that there
wouldn't be a problem...Just as there is no problem with
        soldering on Ni Au. with immersion gold.

        This was a digital application but running at 90 Mhz.

        That's about all I know.  You are correct, the connector Mfg. do not
know, or are not willing to talk.

        [log in to unmask]

> -----Original Message-----
> From: Phillip J. Dudley [SMTP:"[log in to unmask]"@flash.net]
> Sent: Monday, December 08, 1997 2:35 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Ni/Au and Press-Pin!
>
> Anne Blaquiere-Nowlan wrote:
> >
> > Subject: Ni/Au and Press-Pin!                             12/9/97   3:57
> PM
> >
> > Hello TechNetters!
> >
> > Has anyone investigated/tested the reliability and risks associated with
> the
> > use of Tin/Lead compliant press-pins in Gold inserts (Nickel/Gold board
> > finish)?
> > I know Amp has never looked into this and neither has Berg.
> > Any information or lead would be greatly appreciated.
> >
> > Thanks.
> > Anne Blaquiere-Nowlan
> > NPI Process Engineer
> > Newbridge Networks Corporation
> > e-mail : [log in to unmask]
> >
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> The reverse combination (Au over Ni pins in Sn/Pb holes) was frequently
> used in the past, particularly for advanced pins which were used in
> small quantities and were barrel plated rather than selectively plated
> in bandoliers.  I am not aware of any problems with this technology.
>
> Phil Dudley
>
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