Jim,
I would be very interested in learning more about this process. Do you
have several board suppliers that provide this for you? How much of a
cost adder is it? What is the smallest hole that can be filled and
plated over? Could you give me a more detailed explanation of the
polyimide bonding? What type of product  has this process been used for
(is it BellCore applicable)? Any further info you could give me would be
greatly appreciated as we would like to fill and plate vias on some of
our product. My email is [log in to unmask] and my phone is 978-960-3224.
Thanks in advance,
Robert Furrow

>----------
>From:  Jim Marsico 516-595-5879[SMTP:[log in to unmask]]
>Sent:  Monday, December 01, 1997 10:21 AM
>To:    [log in to unmask]
>Subject:       Re: [TN] Via in Pad for BGA
>
>We do use via-in-pad technology for our BGA components.  Our boards are
>designed, however, with a thin layer of polyimide which is bonded to the back
>side of the multilayer board.  During the bonding process, the vias get
>filled
>with resin.  We then require our suppliers to copper plate over the resin
>filled vias then solder coat.  The result is a solid surface mount pad with a
>via inside which is undetectable.
>
>Jim Marsico
>(516) 595-5879
>[log in to unmask]
>
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