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Subject:	Re: BGA: Double Side
From:	"Cyker, Howard A (Howard)" <[log in to unmask]>
Reply To:	TechNet Mail Forum.
Date:	Tue, 9 Dec 1997 14:22:47 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (54 lines)

BGA's can be assembled on the bottom side of a PWB without using
adhesive depending upon the weight, and package size.  Adhesive is not
necessary, and not recommended due to repair issues.

Howard Cyker

>----------
>From:  Gino Cochella[SMTP:[log in to unmask]]
>Sent:  Tuesday, December 09, 1997 10:53 AM
>To:    [log in to unmask]
>Subject:       [TN] BGA: Double Side
>
>                           Subject:                         Time:   8:30 AM
>                           BGA: Double Side                 Date:   12/9/97
>
>Hi everyone,
>Do you have any experience with PWB assemblies with BGAs on both sides of the
>board? What about BGAs that are back to back? Do I need to use any type of
>SMT adhesive to hold in place BGAs during second side reflow? or the molten
>solder's surface tension is enough to hold the BGAs on the back side during
>reflow?
>Thanks in advance
>Gino Cochella
>Process/Manufacturing Engineer
>(310) 814-3955
>
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