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December 1997

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Mon, 8 Dec 1997 02:12:27 -0600
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     Yuan,

     All available Surface Finishes have pros/cons.  Of all the pros/cons,
     most of us are willing to live with cons of using OSPs.  So, continue
     or make the transition in using an OSP.  NiAu is great, however, if
     this is a Smart Card application, low cost is usually the driver.

     Choose your weapon carefully.  We are lucky to even test our Smart
     Cards, considering real estate, especially assembled.  When testing
     the Fab, use the following probes, Point Tip or a Tri-Point Tip.
     These probes will penetrate contaminates, or in this case, the OSP to
     make electrical contact.  A mechanical assisted test fixture will also
     ensure better results versus a vacuum assist fixture when using the
     mentioned probes.  Good Luck.

     John Gulley



______________________________ Reply Separator _________________________________
Subject: Re: [TN] entek plus process
Author:  LI YUAN <[log in to unmask]> at Internet


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