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Reply To: | TechNet Mail Forum. |
Date: | Mon, 8 Dec 1997 02:12:27 -0600 |
Content-Type: | text/plain |
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Yuan,
All available Surface Finishes have pros/cons. Of all the pros/cons,
most of us are willing to live with cons of using OSPs. So, continue
or make the transition in using an OSP. NiAu is great, however, if
this is a Smart Card application, low cost is usually the driver.
Choose your weapon carefully. We are lucky to even test our Smart
Cards, considering real estate, especially assembled. When testing
the Fab, use the following probes, Point Tip or a Tri-Point Tip.
These probes will penetrate contaminates, or in this case, the OSP to
make electrical contact. A mechanical assisted test fixture will also
ensure better results versus a vacuum assist fixture when using the
mentioned probes. Good Luck.
John Gulley
______________________________ Reply Separator _________________________________
Subject: Re: [TN] entek plus process
Author: LI YUAN <[log in to unmask]> at Internet
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