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Reply To: | TechNet Mail Forum. |
Date: | Wed, 3 Dec 1997 12:29:11 -0800 |
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The plating process used is driven by technologies
manufactured. There are definite trade offs with each
process, nothing is free. Circuit boards are getting
thicker and holes getting smaller, while circuit
designs are becoming more complex and performance like
impedance control more critical. Panel plate yields
superior copper thickness distribution in the thru
holes by minimizing current density variations, yet in
doing so adds copper thickness to the base foil which
complicates the etching process for finer line and
space technologies. Pattern plated product is much
easier to maintain tighter line tolerances at etch
since base foil thickness is very uniform, however
copper thickness variations in the holes and on the
surface features are much larger which can jeopardize
hole tolerances and impedance. There are many
variables which help a manufacturer to define the best
plating process for their application, things such as
etch type (cupric vs. ammoniacal), product mix, other
process capabilities such as image and lamination.
Flash plating is just a combination of panel and
pattern plate which attempts to gain some of the
benefits of each process, added steps in the
manufacturing process are never good though and can
greatly impact cost and capacity.
Tony King
Sanmena Nashua N.H.
603-886-0066
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Subject: [TN] Plating
Author: "TechNet Mail Forum." <[log in to unmask]> [log in to unmask] at INTERNET
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