LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

December 1997

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET December 1997

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Condense Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Sender:	TechNet <[log in to unmask]>
X-To:	[log in to unmask]
Date:	Mon, 8 Dec 1997 09:48:20 -0800
Reply-To:	"TechNet Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:	Re: Gold plating thicknes
From:	[log in to unmask]
Content-Transfer-Encoding:	7bit
In-Reply-To:	<[log in to unmask]>
Content-Type:	text/plain; charset=US-ASCII; name="[TN]"
MIME-Version:	1.0
Parts/Attachments:	[TN] (15 lines)

     As long as your gold thickness does not exceed approximatley 35
     microinch you should be safe from gold embrittlement problems. Gold
     does not add to solder joint strength it is only used for pad
     solderability preservation and connection contact integrity. For good
     solderability preservation a good rule of thumb is to not have the
     gold thickness any less than 3 microinch.

     Steve O'Hara   HP


______________________________ Reply Separator _________________________________
Subject: [TN] Gold  plating thicknes
Author:  Non-HP-bogdan ([log in to unmask]) at HP-Vancouver,mimegw10

ATOM RSS1 RSS2

LISTSERV.IPC.ORG