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Date: | Wed, 31 Dec 1997 12:39:41 +0200 |
Content-Type: | text/plain |
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Yuan,
Reading again carfully through this para.(4.3.2) it is not explicit
about BGA coplanarity.
It was my assumption since the document mainly deals with BGAs.
Mickey
LI YUAN wrote:
>
> Mickey,
>
> I don't have a J-Std-013 handy now. I believe it states that the 4-mil
> spec. applies only to the leaded components, i.e. QFP while the spec. for
> BGAs is 8 mils. Could you verify this?
>
> Thanks,
>
> Yuan Li
> Research Associate
> CAMPmode (Center For Advanced Manufacturing and Packaging of Microwave,
> Optical and Digital Electronics)
> University of Colorado at Boulder
>
> On Tue, 30 Dec 1997, mickey weiner wrote:
>
> > Dennis Fall wrote:
> > >
> > > I was wondering if there is an industry standard for coplanarity of
> > > solder spheres on a BGA package. Any insight will be greatly
> > > appreciated.
> > >
> > > --
> > > Dennis ,
> > I find in j-std 013 (4.3.2) that accepted coplanarity throughout
> > the component lead configuration is 0.1 mm (4 mils).
> > It does not specify if it takes into account both ball variation
> > as well as substrate's bow & twist.
> >
> > Season's Greetings to everybody on TechNet
> >
> > Mickey
> >
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
michael weiner Tadiran Telecommunications Ltd
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