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December 1997

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TechNet <[log in to unmask]>
Date:
Thu, 18 Dec 1997 10:18:05 +0000
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"TechNet Mail Forum." <[log in to unmask]>, tana <[log in to unmask]>
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Subject:
Re: Via in Pad for BGA
From:
tana <[log in to unmask]>
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University of Salford
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Authenticated sender is <[log in to unmask]>
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> Richard Hamilton wrote:
>
> >Robert and Jim,
> >
> >Being new to this 'SMT' stuff, I would also be interested in following
> >this thread, here on the forum if appropriate and feasible.
> >
> >Thanks.
> >
> >Richard Hamilton
> >Clemar Mfg. / Rain Bird
>
> Richard, I got a few e-mails sent directly to me requesting similar
> information.  Please send me your e-mail address so I can respond to those
> interested.
>
> Jim Marsico
> (516) 595-5879
> [log in to unmask]
>
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>

Hi!

I am also interested in the Via in pad technology. Put my name in
your list.

Thank you.
Dr. Nguty
Tennyson Nguty, AeroMech Department, Newton Building, Salford University
Manchester M5 4WT, UK. Tel: 0161-745 4696/5951, Fax: 0161-295 5575/5108

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