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Fri, 12 Dec 1997 07:26:26 -0600 |
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Hi Gaby - two general rules of thumb to thick about to avoid gold
embrittlement:
1) Is there enough solder volume for the gold layer to diffusive into and
stay below a 3% by weight limit?
2) Is the solder process long enough and hot enough to allow #1 to occurr?
Most gold embrittlement problems are a result of inadequate processing
(rule #2). The JSTD 001 paragraph 5.4.1 contains the assembly requirements
for dealing with gold. You can apply the rules of thumb on pwbs too. Also,
IPC-TP-1103 "Manufacturing Concerns When Soldering With Gold Plated
Component Leads or Circuit Board Pads" by M. Ferguson is a good reference
paper to browse. Good Luck.
Dave Hillman
Rockwell Collins
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[log in to unmask] on 12/08/97 12:18:04 PM
Please respond to [log in to unmask]; Please respond to [log in to unmask]
To: [log in to unmask]
cc: (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject: [TN] Gold plating thicknes
Hello Technetters,
The ipc-6012 specifies, in table 3-2, gold thickness of 0.8 microns
for all three classes, maximum , on solderable surface.
What is usually accepted thickness for reliable surface mount
solder joints ?
Thank you
Gaby
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