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November 1997

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Subject:
From:
RAYMOND YONG <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 6 Nov 1997 17:51:16 +0700
Content-Type:
text/plain
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text/plain (25 lines)
Hi,

I am working on the qualification for PIN-THROUGH PASTE PROCESS.

Could you advise the IPC acceptable and rejectable soldering criteria for
the top and bottom side solder fillet for through hole joints.

Looking forward to your reply.

Thank You

Regards

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