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November 1997

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Subject:
From:
"Phillip E. Hinton" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 6 Nov 1997 01:47:23 -0500
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Aric,

Try the specification for electrodeposited tin lead coating, ASTM-B-579.
 This is the tin/lead electrodeposited coating specification that is required
in the Rigid Board Performance Specfication, IPC-6012.

Phil Hinton

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