Sorry for asking, but why in the world would you want unfused tin/lead
on what I am presuming is a copper conductor.  The tin will migrate into
the copper forming a tin-copper intermetallic layer very quickly; the
solderability of such a surface will be very poor.  You can plate tin-nickel
or solder over nickel and have much better results, both for solderability
retention and for acting as a "lubricant" in the case of tin-nickel.

Perhaps you could elaborate as to what you are trying to acheive.

Regards,
Fred J.

>>> Aric J Parr <[log in to unmask]> 11/05/97
01:50pm >>>
     I am trying to find a specification for plating tin/lead on some
     parts. I do not want it fused.

     I haven't found an IPC spec for this.

     Can anyone help me?

     Thanks,


     Aric Parr

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