TECHNET Archives

November 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
john maxwell <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 5 Nov 1997 12:24:40 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Jim,
Look for the possibility of condensing moisture and electroplating tin from
the capacitor termination across the chip surface. I have seen this happen
with 0805 sized parts before. It is less likely that it is silver. Nickel
barrier chips still have a silver/glass frit termination which is Ni plated
with a Sn/Pb solderability coating to preserve solderability. Only a small
to non existent portion of the silver at the termination edge would be
available for plating or dendrite formation. Again with silver there needs
to be moisture present

Regards,


John Maxwell
Please contact me off line at [log in to unmask] if there are any further
questions.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2