Hi Sam,
      A couple of ideas to try - Shorten the dwell in the solderpot (about 1
or 2 seconds) then crank up that ascent speed. ( I know that this seems like
it would be contrary to belief) Less flux on the panel or a thinner flux
might help as well. If  panels have tin on them (used as etch resist) , leave
the tin on and just flux and level at the same parameters listed above.  Word
of caution though -watch that tin content and monitor the contaminant level
closely as well. Let me know how you make out.

Bob Daniels, Jr.
ECC Corp.

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