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November 1997

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Subject:
From:
Max Bernhardt <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 4 Nov 1997 16:23:00 -0600
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Technet,

We are in the process of qualifying a board assembly house to build some
of our assemblies.  Since we have never gone to an outside house before,
we are kind of flying blind.  Right now, we want to qualify a vendors
process and have come up with a test plan.  The plan includes SIR
testing, Ionic board contamination testing, Vesication testing and a
thermal cycle of 10 excursions over the storage temperature of the board
to test the solderability of the assembly.  Does anyone have any other
tests or recommendations that they follow when qualifying outside
assembly houses.  We build to an IPC class II with some exceptions.  Any
help would be appreciated.

Max Bernhardt
Woodward Governor Co.
970-962-7376

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