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November 1997

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Subject:
Cutting internal layer traces
From:
Thomas Phelps <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 4 Nov 1997 16:24:00 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines) 
Hello,

I am in the process of defining process limits for our current raw board
ECO process (the cutting of
traces and the drilling out of plated barrells).  The ECO work needs to be
done at our facility
(we only load PCBs).

If you are performing similar rework at your facility then what process
limits are you using?
What is the smallest trace width and spacing width combination that you can
repeatably cut?

Do you blind cut internal traces?  If so, then what limits are you using?

Thank you for your input.

Tom Phelps

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