Hello technetters,

1- What is the typical surface tension values for copper electroplating
solution ?

2- What is the smallest hole size processed with the above mentioned
values ?

3- What is the smallest line width (Pattern plate) ?

4- Does anyone uses surfactants or wetters along with plating additives
to lower the surface tension ?

        4.A - If yes, which product is used and what is the
concentration range ?

5- Any negative impact on physical characteristics of plated copper ?


Thank you in advance for responding,

Regards,
Charles Desroches
Technical Advisor
Viasystems Canada inc.

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