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November 1997

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Thu, 27 Nov 1997 15:38:59 +0100
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Hello Technetters,
I have understood from different sources that use of thin plastic packages like TSOP and TQFP is not rekommended in more severe environments. Does anyone know the reason for that?
Are there tests done that show bad reliability over time or is the problem that they cannot withstand the soldering process?

Regards
Sven-Eric Bäckström

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