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November 1997

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Subject:
From:
sam mccorkel <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 4 Nov 1997 13:56:01 -0500
Content-Type:
text/plain
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text/plain (26 lines)
In an attempt to receive more responses, I'm resubmitting the following -

We've been using our hot air leveler to apply tin / lead for boards that
require a T/L finish. Our hal machine is vertical.

We're having trouble with boards that have large ground plane areas. The
solder isn't as flat as we need it to be and it puddles around the large
holes. We'd like to know if anyone out there has advise on what to adjust or
if a different process is recommended.

I know this is a broad issue but would appreciate any comments.

Thank you!

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