[log in to unmask] wrote:
>
> Please explain further how shields (in electrolytic copper plating I presume)
> can influence air bubble entrapment.
>
> Peter BlokhuisFloating shields require the use of top loading jigs. The shield floats directly under
the flight bar positions and is held horozontally in postion by guides at either end of
the plating cell. These guides are connected to the agitation frame and allow the shield
to be moved vertically to any position between the top and bottom of the solution.The
final depth of the shield is determined by the length of the board that pushes down on
it when the flight bar is lowered into position. As the agitation frame moves so does
the shield hence the top, middle and bottom of board move uniformly through the solution
forcing solution through the holes, expelling any air and preventing any gas build up.


Roger Hammond

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