TECHNET Archives

November 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Assembly (Solderability)
From:
Achim Neu <[log in to unmask]>
Reply To:
[log in to unmask], [log in to unmask], [log in to unmask], [log in to unmask], [log in to unmask]
Date:
Wed, 26 Nov 1997 23:19:41 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Hello Dave,

you wrote that the EIA/ IPC committees is working for one document of
solderability
specification. Could you share me what decision is done to cover SnPb
plated and
Pd plated compounends in one specification ?

Thanks in advance for help in this area.

Achim Neu
SIEMENS R&D

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################

ATOM RSS1 RSS2