Peter, you may also wish to evaluate 3M 9901 or 9902 bonding film.  The bond temp is somewhat lower, at around 180C, the Dc is 3.4 with a dissapation factor of 0.018.  I have used this material to completely fill .006" holes in mixed material panels that were >.043 thick, something that I was unable to do with the Gore material.  

Contact Cameron Murray, Research Specialist, 3M Industrial Tape and Specialties Division, Bldg. #230-2E-11, St. Paul, MN USA 55144
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Regards, Fred J.

>>> peter dahlen <[log in to unmask]> 11/26/97 08:47am >>>
Hi, I have received some information in my subject PTFE bonding......

The information will indicate to types of bonding films which seems possible
to use in combination with the 6002 material. It is the DuPoint film FEP and
the Speedboard C. Both will have a bonding temp. like 240-290C which are
higher than normal FR4 pressing, but it seems that some PCB manufacturer
have that type of equipment, and the temp. is less than a direct fusing bonding.
If the bonding temp. will be less than 200C, I think it will be problem to
vapour phase solder the boards and maybe also hand solder without delamination.

For the PTH or blind via, I think it will be better to use a plasma etching
of PTH insted of using the Sodium Napthalene this due to that it will be a
mix of materials Duroid/Bonding film/Polyimide, anyone with any comments
regarding PTH in these material?

And also how about?

- The two films: FEP or Speedboard any + and - ?

- Will both fillout between the conductors on internal layers to avoid voids?

- Is it possible to use these material to fill blind via?

- Can both be used with combination with vapour phase soldering?

- CTE value for these materials?

- Outgassing tested?

- Anything more....

Best Regards

Peter Dahlén
Saab Ericsson Space

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