Hi Darrell - The industry is moving away from Military specifications but
not solderability requirements! The MIL-STD-202, mtd 208 is a mirror image
of the ANSIJ-STD-002 specification except for some minor differences so you
should make the transition with little noticeable change. The EIA/IPC joint
solderability committees are presently working with the respective JEDEC
groups to work toward consolidation of component solderability
specification requirements into one document so the reality of having one
solderability requirements document is active and lively effort!


Dave Hillman
ANSIJ-STD-002 Committee CoChariman
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[log in to unmask] on 11/21/97 09:04:44 AM

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cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TN] Assembly (Solderability)




We are a small PCB assembly facility for mostly thru hole, but have a
nice repair station for our surface mount technology.  We normally order
our components and wire with requirements for solderability conforming to
MIL-STD-202 Method 208.  We are increasingly being told by our
distributors that the industry is moving away from these types of
requirements.  I can hardly believe that solderability is being phased
out, but is there a more current IPC or industry specification or
standard for solderability.  It's hard to know what the larger
organizations are doing.  I would appreciate any feed back on this.
Thanks
Thank You,
Darrell Bonzo
EDO Corporation/Acoustic Division
Tele. 801-486-7481 Ext. 329
Fax   801-486-1447
E-Mail [log in to unmask]
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