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November 1997

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Date:
Tue, 25 Nov 1997 16:15:02 MST
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  **ERROR** LONG FROM FIELD. FIELD WAS CUT. OLD FIELD WAS:
[log in to unmask], [log in to unmask], [log in to unmask],          93059@ns0
.donau.de, [log in to unmask] ALL

I am working on a kind of specification which should desribe the
polyimide surface of chip passivation. The chip will assemble in Flip
Chip and the polyimide must guarantee a good adhesion to epoxy
underfiller.
Any input is welcome to necessary parameters which should be describe
and why.

Regards
Achim

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