Gentlemen,

I am looking for advise, checkpoints, pit falls, etc. on double sided
PCB assembly methods.  I have recently been informed by our
engineering department that we will be advancing our board
circuit densities by extending our bottom side component population
from simple chip cap/resistors to active integrated components.  I
would greatly appreciate a few words from anyone presently
producing high density, mixed technology, double sided boards, that
can provide process insights.


Lee McCuistion
Manufacturing Engineer
Cubix Corporation
2800 Lockheed Way
Carson City, NV  89706
702-888-1000 x237 (voice)
702-888-1002 (fax)
[log in to unmask] (e-mail)

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