Peter,

        The type of material you are working with from Rogers Corp has very
high reliability properties when it comes to hybrid multilayer boards.
When building this kind of board, in particular for space applications,
it is important that the materials you select have compatible CTE's
(coefficient of thermal expansion) in the X,Y plane (to prevent warpage)
and low Z axis CTE (for plated through via reliability). There are
several space programs that used bonded RT/duroid 6002 material, and the
film used is FEP film from DuPont. It is a high temperature melt film
(260C melt), so the bonding has to be done in two steps

1)first, bond the RT/duroid 6002 layers together
2)second, bond the MLB to the polyimide layers using standard polyimide
bond films (as long as the RT/duroid 6002 surface is a ground plane).

RT/duroid 6002 material has been tested by NASA and meets the outgassing
criteria. There is another material from Rogers called RO4003 high
frequency material which is a thermoset/glass laminate (no PTFE) that
has similar high frequency performance but can be bonded as if it were
an FR4 material. You can take a look at the data sheet in the company's
website  http://www.rogers-corp.com/mwu/ or you can contacnt me for
additional information. Thank you.

Art Aguayo, Technical Support Manager
[log in to unmask]
Rogers Corporation, Microwave Materials Division

peter dahlen wrote:
>
> Hi,
>
> I would like to have some help to select material to a multilayer board and
> also some
> good ideas regarding how to design this type of board.
>
> The board is a combination of material with 3 sheets of "microwave material"
> and 6
> sheets of Polyimide/glass. In total 6 Cu layers in the microwave part and 12
> Cu layers in
> the other part. We are now using Rogers Duroid/6002 material in the
> "microwave part"
> and standard 5mil Polyimide/glass in the other part.
>
> The problem is to find a bond film or prepreg for bonding the microwave
> sheets and this
> with a pressing temperature and pressure in the same range as standard
> material (FR4 or
> Polyimide).  It is not necessary that is it the Rogers Duroid 6002, we can
> also use other
> material, but is shall have nearly the same technical data as the 6002 and
> also that the
> data/material are stabile in temperature.
>
> The board shall be submitted for thermal cycling so the CTE shall be low or
> similar to
> Polyimide.
>
> The board will also include blind via.
>
> So if anyone have some experience in multilayer PTFE boards, I would like to
> know the
> following:
>
> - Microwave material with the same technical data as 6002 to be used in a
> multilayer
>
> - Bond film or prepreg to be used in combination with above material, and
> which can be
> bonded in standard press-equipment's. Please also add temperature and pressure.
>
> - Any recommendations to do this type of job.
>
> Best Regards
>
> Peter Dahlen
> Saab Ericsson Space
> Sweden
>
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