HI KEN,

FROM A COST STAND, ELECTROLYTIC GOLD IS MUCH MORE EXPENSIVE TO RUN THAN
ELECTROLESS, ADDITONALLY YOU MAY NEED TO BUS FOR CONTINUITY AND THIS WILL
ADD TO PROCESSING COSTS AND TURN AROUND TIME. IN SMT DESIGNS THE
ELECTROLESS
GOLD IS ONLY AN OXIDE PREVENTION LAYER ON THE NICKEL. SOLDERING OCCURS ON
THE NICKEL, HENCE UP TO ABOUT 7-10 MICROINCHES IS NORMAL FOR A GOLD
DEPOSIT. ELECTROLYTIC DEPOSITS ARE  HIGHER AND ACTUALLY
USED IN PATTERN PLATING FOR  INCREASED CONDUCTIVITY, HENCE IT WOULD BE A
WASTE OF RESOURCES.

LK


On Mon, 24 Nov 1997, Ken Patel wrote:

> My fab supplier do not have immersion gold at this moment. And I am calling
> out immersion gold as fab note so in that regard I have a small question...
>
> Will it be OK to deposit gold electrolytically instead of immersion? Any
> problem what so ever? He is willing hold my tolerances.
>
> Any help will greatly appreciated.
>
> re,
> ken patel
> ______________________________________________________
> Ken Patel                       Phone:  (408) 490-6804
> 575 Cottonwood Dr.              Fax:    (408) 490-6859
> Milpitas, CA 95035              Beeper: (888) 769-1808
>
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