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November 1997

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Subject:
From:
John Guy <[log in to unmask]>
Reply To:
Date:
Tue, 25 Nov 1997 08:13:20 -0500
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Tenison,
        If you have checkout pad geometry, stencil aperture geometry, and your
placement process, the problem may reside in the reflow process.  Have you
taken a thermal profile of the process?  If so, look to see that you have
proper preheating of the assembly.  If that all looks good, check the
solderability of the components.  Try both sides of the components. It is
unlikely that this will be the problem, but it couldn't hurt to check it
out.  What you are looking for is anything that might cause an uneven
wetting force on one side of the component.
        This isn't a complete list, but it should get you started in the right
direction.  If you want to talk about this, feel free to give me a call.

Hope this helps

John Guy
ACI / EMPF
714 N. Senate Ave.
Indianapolis, IN 46202-3112
voice:  (317) 655-EMPF ext.130
fax:    (317) 655-3699
e-mail:         [log in to unmask]

-----Original Message-----
From:   Tenison Stone [SMTP:[log in to unmask]]
Sent:   Monday, November 24, 1997 2:41 PM
To:     [log in to unmask]
Subject:        [TN] tombstoning

I have having trouble with tombstoning on a large flat with lots of 0402
parts.

I have investigated pad geometry, stencil aperture geometry, and
recalibrated placement equipment.

Can anyone help with this problem?

Tenison Stone
Telex Communications

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