Charles,
I have performed trials and produced assemblies with "via in pad" for BGA
devices. I have X Ray prints and cross sections for this also. I'm sorry
that I can't give the details over TechNet, but if you (or anybody else
interested) cares to E mail me then I will return the specifics privately.

Thanks
Eddie
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I am researching the possibility of puttings vias in pads for BGA.

Is anybody using "Via in Pad" for BGA ?
What are the implications (pros/cons) of using "Via in Pad" for BGA ?
Is the type of BGA (PBGA/CBGA/TBGA) of importance ?
(I am especially interested in non-microvia applications).

Thanks in advance.
Charles Elliott
NPI Process Engineer
Newbridge Networks
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