We are finding a particular tin/lead dipped J-leaded component has a
very low pull strength when we test the solder joints.  Visual
inspection tells us we have good heel fillets, but there are no side
fillets at all.  When we do the pull tests we are left with a bare lead
with no solder on it.  Question: can corrosion start at the surface of
the solder/lead material interface and work its way into the interface
and cause the delamination, or is this just another case of improperly
cleaned leads before solder dipping?

Any comments would be greatly appreciated.
Bev Christian
Nortel
613-967-5407
[log in to unmask]

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