TECHNET Archives

November 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Via in Pad for BGA
From:
Alan Cochrane <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 24 Nov 1997 17:40:01 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Charles,

Multek has worked with via in pad for BGA's as well as SMD's.  The issue is
typically with the assembler and not the board fabricator.  The only people
that I know that are doing this type of assembly now is Xetel in Texas.
Xetel published a short article in EP&P.

Regards,

Alan B. Cochrane
Corporate Director of New Technology
Multek Inc.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################

ATOM RSS1 RSS2