Hi everyone.

We think we have an adhesion issue with our adhesive glue
(chipbonder)(LOCTITE 348 and 3609) to PCB that are coated with Taiyo
(PSR4000) glossy.  I am talking about adhesion of the glue, when it is
deposited to the board, before we put the componant, before curing.  It
seems like the glue is not adhering very well to the solder mask and it has
a tendancy to come back with the dispenser rather than staying on the board.
This solder mask and these glues are not new in our process, but the issue
is recent.

Has anyone seen this phenomenon before ?


NOTE: I am NOT talking about adhesion of the componant to the board once the
glue is cured.

thanks in advance.

AL

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