TECHNET Archives

November 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Paul Gould <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 24 Nov 1997 20:12:20 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (34 lines)
Bogdan Gaby wrote:-
>How do you ensure the integrity of the plating in small vias?
>We require the manufacturer's cross sections as a proof of test
>for our circuits.Very seldom,they contain small vias.
>But,anyway,the failures found recently in our line are in random places
>on the boards.
>Are there other tests on bare boards which can detect reliability
>problems ?

Bare board electrical test, if carried out properly, should detect any
opens in via holes. If the board is double sided with surface mount both
sides, testing must be simultaneous and not single sided flip test.

However, this will only detect complete voids and partial voids will
still get through. There is no substitute for good quality manufacture.

Good luck,
Paul Gould
Teknacron Circuits Ltd
[log in to unmask]
Isle of Wight,UK

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2