Technical Conference
April 28-30, 1998
Long Beach Convention Center
Long Beach, CA
At this 3-day technical conference, you'll find the newest information to help you precisely tune your manufacturing process to its peak performance. Our program committee brings a wide variety of industry expertise together to sort through and choose only the strongest and most interesting technical papers. The categories are familiar: Microvias/HDIS, Materials, Design, Fabrication, Assembly, EH&S; but the papers are new and exciting. Over 75 technical papers will be presented.
There are still more papers to review. As the conference continues to develop, check our website for the most up-to-date information:
www.ipc.org/html/expocov.htm
Microvias/HDIS:
· Designing and Fabrication Multi-Depth Via-in-Pad PCBs: Production, Larry Burgess, MicroPak Laboratories
· Advantages of Low Pressure Plasma Etching in Addition to the Formation of Microvias, Hermann Schmid, Technics Plasma GmbH
· The Effects of FR4/Glass Compositions and RCC Resin Formulation on UV Laser Drilling of Microvias, Carey Pico, Electro Scientific Industries
· Innovative Uses for Imprinted, U-Shaped PWB Traces and Microvias, George Gregoire, Dimensional Circuits
· Multilayer Printed Circuits with Exacting Registration Requirements - Achieving Next Generation Design Capabilities, Edward Kelly, Hadco
· Integrating the Production of Microvia-Based High Density Interconnect Boards into the Mainstream, Jim Paulus AlliedSignal Laminate Systems
· New Dielectric Materials for Microvia Technology, Bernhard Sailer, Ciba
· Quality of Drilling for Microvias, Octavian Iordache, Circo Craft
· Integrated Component Boards and Related Packaging Technologies - Ways to Add Value to the PWB, Dieter Weiss, Dielektra GmbH
Materials:
· Hygroscopic Expansion of Polyimide Film, Richard Sutton, DuPont
· High Performance Resins for PWB, MCM and Encapsulations, M. Albert Capote, Aguila Technologies
· New PTFE Laminates for Price-Sensitive Microwave Applications, Robert Bryant, Arlon Materials for Electronics
· New Low Dielectric, High Tg Printed Circuitry Substrates, Eric Holman, AlliedSignal Laminate Systems
· Moisture Absorption Properties of Laminates Used in Chip Packaging Applications, Gordon Smith, AlliedSignal Laminate Systems
Design:
· Modeling PCB Process Effects on Controlled Impedance, William Ward, Raytheon TI Systems
· Chip Scale Packaging Design Guidelines for Aerospace Applications, Stephen Stegura, Hughes Missile Systems
Fabrication:
· The Role of Dry-Film Lamination in the Making of Ultra-Fine Pitch PC Boards, Edward Hagan, DuPont Photopolymers & Electronic Materials
· Reducing Metal Usage and Improving PWB Quality Through the Use of Agitation, Ted Halahel, Serfilco Ltd.
· Polymer Thick Film Via Plug for PCBs and Packaging Applications, Rich Wessel, E.I. DuPont
· Sodium Permanganate and Potassium Permanganate for Plated-Through Hole Processing, Tim Colgan, Carus Chemical
· Solder Mask Compatibility with High Performance Requirements Driven by the Assimilation of the Chip with the Printed Board or Conventional PCB Materials, Torsten Reckert, Ciba Specialty Chemicals
· Qualification of PWB Suppliers, Navin Arora, 3COM
· Various Applications and Production Uses of Immersion White Tin in the Fabrication of Printed Wiring Boards, Richard Edgar, Florida CirTech
· Liquid Photoimageable Solder Mask (LPISM) for Electroless-Nickel / Immersion-Gold PWB Surface Finish, Bret Tauscher, Enthone-OMI
· Drill Hole Quality - A DOE, Les Connally, Raytheon TI Systems
· Rackless Continuous Vertical Plating Equipment for Printed Wiring Boards, Kenji Ogawa, C. Uyemura
Assembly:
· The Behavior of Conductive Ink Curing in Both the Vapor Phase and a Convection Oven, Hui Wang, Kester Solder
· Optimizing Reflow Profile Via Defect Mechanisms Analysis, Ning-Cheng Lee, Induim Corporation of America
· Electroless Gold Plating Contact Pads for Memory Modules/Cards, Danny Yeung, Hitachi Microsystems
· Solderability Management Using Reduced Oxide Soldering Activation (ROSA) Technology, David Hillman, Rockwell International
· Palladium Surface Finish for High Density SMT Assemblies and Soft-Touch Switches, Stephen Bishop, Photocircuits
· Solder Past Tack: Evaluation by Dynamical Methods, Alain Meyer, AED
· Evaluation of Solder Pastes Using a Wettability Tester, Bev Christian, Northern Telecom Ltd.
· A Controlled Horizontal Hot Air Solder Leveling Process for Ultra Fine Pitch, Jack Fellman, Shipley
· Electroplating of Tin-Bismuth and Tin-Silver Alloys as Lead-Free Solders, Isamu Yanda, C. Uyemura
Environmental Health & Safety:
· Water Reuse Project, Jeff Erb, Multek, Austin
· Accountable Resource Management of Residual Products from the Circuit Board Industry, James Gardner, Metech International
· Water Reuse for Printed Circuit Boards: When Does It Make Sense?, J. Michael Hosea, Resource Management & Recovery
· Wastewater Treatment Technologies of Choice for the Printed Circuit Board Industry, David Hill, US Filter/Memtek
Free Forums:
In addition to the technical papers, all attendees are invited to attend the Free Forums. Hear from expert panelists on a variety of timely topic at no charge. Watch for the final program or visit the IPC website for scheduling and presenter information:
Laser Via Drilling
New Developments in the World Market for PWBs
EH&S Compliance Assistance
Hot Air Leveling: The "Lazarus" Finish
Environmental Management Systems
ITRI Consortia - The Results, The Plans
New Pollution Prevention Technologies
IPC's New Standards and Specifications: How Do They Affect You?
Recruiting and Coping with a Changing Workforce
Lisa Williams
IPC
2215 Sanders Road
Northbrook, IL 60062
ph: 847/509-9700
fx: 847/509-9798
email: [log in to unmask]
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For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
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