TECHNET Archives

November 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re[2]: [TN] Plating integrity in small vias
From:
[log in to unmask]
Reply To:
TechNet Mail Forum.
Date:
Mon, 24 Nov 1997 11:38:35 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (10 lines) 
     Make sure that the smallest PTH's have been properly bake and thermal 
     stressed before cross sectioning, then you can have confidence that 
     the PTH's are good.


______________________________ Reply Separator _________________________________
Subject: Re: [TN] Plating integrity in small vias
Author:  peter dahlen <[log in to unmask]> at SMTPpost

ATOM RSS1 RSS2