TECHNET Archives

November 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Charles Elliott <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 24 Nov 1997 08:24:44 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)
                      Subject:                              Time:  8:18 AM
  OFFICE MEMO         Via in Pad for BGA                    Date:  1997.11.24

Hello Technetters,

I am researching the possibility of puttings vias in pads for BGA.

Is anybody using "Via in Pad" for BGA ?
What are the implications (pros/cons) of using "Via in Pad" for BGA ?
Is the type of BGA (PBGA/CBGA/TBGA) of importance ?
(I am especially interested in non-microvia applications).

Thanks in advance.
Charles Elliott
NPI Process Engineer
Newbridge Networks
[log in to unmask]

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2