Hello,

There is a thread currently running on the Designers Council regarding
Intrusive Reflow (using solder paste application and reflow
to solder through-hole parts in the same step as the SMT parts).

IMHO, this is also worth discussing on Technet, because it is clear that
this technology to solder the last few TH parts onto the SMT assembly can
eliminate (partial) wave soldering in a lot of cases. I take it for granted
that eliminating all TH parts is mostly impractical.

So here are a few questions - any reactions welcome.

Thank you !

Peter Willaert
Agfa-Gevaert N.V.

Questions regarding Intrusive reflow

1. experiences with intrusive reflow ? (who is doing it)

2. relation pin diameter/hole size/solder paste volume ?

3. material compatibility issues ? (which components can stand the IR heat)

4. application of solder paste ? (stencil - dispensing)

5. reliability issues ?

6. any standardization efforts underway ?

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