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November 1997

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Subject:
From:
Darrell Bonzo <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 21 Nov 1997 08:04:44 -0700
Content-Type:
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We are a small PCB assembly facility for mostly thru hole, but have a   
nice repair station for our surface mount technology.  We normally order   
our components and wire with requirements for solderability conforming to   
MIL-STD-202 Method 208.  We are increasingly being told by our   
distributors that the industry is moving away from these types of   
requirements.  I can hardly believe that solderability is being phased   
out, but is there a more current IPC or industry specification or   
standard for solderability.  It's hard to know what the larger   
organizations are doing.  I would appreciate any feed back on this.

Thanks    
Thank You,

Darrell Bonzo
EDO Corporation/Acoustic Division
Tele. 801-486-7481 Ext. 329
Fax   801-486-1447
E-Mail [log in to unmask]

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