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November 1997

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Thu, 20 Nov 1997 10:22:59 -0800
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************************************************************************
*    This message was originated by automatic IPC Chat Session         *
*    Request Page (http://www.ipc.org/IPCchat/IPCchat_request.html)    *
************************************************************************

Brian T. Lynch ([log in to unmask]) announces a Chat session with topic
"IPC Test Method 650 Final 2.3.23 Cure Solder Mask".
The Chat session will be held on 11/20/97, at 11:00 A.M. est

Brian T. Lynch's comments:
To Whom It May Concern,

My customer does not want to use methylene chloride to test for final cure for his liquid photoimageable thermally cured solder mask.  Can anyone recommend another chemical alternative and procedure for checking cure??
Thank-you very much!!!

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If you have any questions or suggestions please contact Dmitriy Sklyar at
[log in to unmask] (tel: 874-509-9700 ext. 311).

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