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November 1997

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Subject:
Re: Reliability of BGA
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 20 Nov 1997 09:58:00 +0200
Content-Type:
text/plain
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text/plain (41 lines) 
Dear Mr.Jeremias

Here the list you asked for:

- Flip-chip BGA assembly process and reliability improvements
Patrick Thomson;  Motorola
IEMT 96

-High reliable FC-PBGA
Yoshihiro Ishida; Citizen Watch
IEMT 96

-Assembly and reliability of thermally enhanced High I/O BGA Packages
T.I. Ejim; Lucent Technologies
IEMT 97

-Product oriented BGA manufacturability and reliability study
Bill Oberlin; Tandem Computers
IEMT 97

- Thermal enhancement and reliability of 40mm EPBGA Packages with interface
materials
Zeki Z. Celik; LSI Logic
IEMT 97

Best regards

G.Grossmann

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