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November 1997

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Wed, 19 Nov 1997 16:25:41 CST
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From: Apollo De Luna             APO7

Subj: Delamination Issues

      Are there any direct correlation between the coupling agents being
used in mold compounds to its resistance to delamination ?

      How about the amount of release agents on the molding compounds,
does it promote delamination ?

      On the type of preconditioning, is there a direct relationship on the
amount and location of delamination on IC packages ?

      Are there technical papers discussing about accelerated failures on
IC due to initial delamination ?

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