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November 1997

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Subject:
Re: J-Lead Mods
From:
James P Carlson <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 19 Nov 1997 07:44:22 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
We are currently using fine pitch parts with a 6 mil stencil thickness to
prevent solder shorts.  What solder thickness did you use in your testing.
I will check to see if the pad patterns we are using match closely with IPC
recommended sizes as well.  I'm concerned with long-term reliability in
harsh military environments.

Jim Carlson
Rockwell A&C

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