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November 1997

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Subject:
From:
Weber Chuang <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 4 Nov 1997 19:02:43 +0800
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (1689 bytes) , application/ms-tnef (3241 bytes)
Hello Ty,

  Did you try the Mentor PCB-sig, it will usually be faster if you post
there. Ask  the Mentor support center for the related email address for
joining the SIG.

regards
weber
VIA tech 

> -----原始郵件-----
> 寄件者:     Ty Thomas [SMTP:[log in to unmask]]
> 傳送時間:       1997年11月3日 下午 11:34
> 收件者:   [log in to unmask]
> 主旨:   [TN] Des: Mentor area fill problem
> 
> Hello TechNetters,
> 
> We're having some problems with area fills using A3f on Solaris.
> If you add a fill area, everything seems ok until you try to edit the
> fill.
> Delete works fine, but if I try to add to the existing fill, it won't
> do
> it
> and gives this message:
> 
> Warning: The following power pins/vias are not contained in any fill
>                  and may short.
> 
> Restructuring the fill wipes it out altogether.
> 
> Any suggestions would be appreciated.
> 
> Ty Thomas
> Paradyne Corp.
> [log in to unmask]
> 
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