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November 1997

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Subject:
FW: ENVIRONMENTAL CONTROL
From:
"Dhawan, Ashok" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Sat, 1 Nov 1997 15:45:56 -0000
Content-Type:
text/plain
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text/plain (36 lines) 
Post it again for advise on this. I wonder there are no comments on
this?
What kind of environmental control being exercised by PCB assembly
houses --for SMT soldering operations?Do you use special solder pastes
-less sensitive to slumping/moisture absorption??
Pl do comment on this.
> ----------
> From:         Dhawan, Ashok
> Sent:         October 9, 1997 12:41 PM
> To:   'IPC TechNet'
> Subject:      ENVIRONMENTAL CONTROL
>
> What is kind of environmental control required for a surface mount
> assembly area.
> Is pre-reflow soldering operation normally enclosed in restricted
> ambience of temp and humidity??
> Is there any IPC standard on facilities requirements on SMT production
> floor??
>
> thanks in advance for all inputs.
>
> [log in to unmask]
>

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