Hi TechNet,

I'm passing along this request from a fellow Applications Engineer.
Evidently, he is trying to dissolve our circuit boards.

Regards,

Dave Sullivan
Rockwell Collins, Inc.

[log in to unmask]
---------------------- Forwarded by David D
Sullivan/CedarRapids/Collins/Rockwell on 11/18/97 12:13 PM
---------------------------


Peter M Carter
11/17/97 04:04 PM

To:   David D Sullivan/CedarRapids/Collins/Rockwell@Rockwell
cc:
Subject:  Acetone interactions with buttercoat, etc.

'afternoon:
     With the withdrawal of the ODS solvents and the costs associated with
some of the alternatives, many users are going back to look at materials
previously bypassed for some processing shortcoming (flammability,
compatibility, narrow process window, etc.).
     For spot flux removal and/or acrylic conformal coat removal, there is
renewed pressure from the production community to evaluate acetone. We have
some historical perceptions about the degree of attack that soldermask
and/or laminate buttercoat can undergo with the use (or misuse) of acetone,
but no one seems to be able to produce any industry reports on the subject.
     Does anyone know of a published study of the laminate surface and/or
soldermask surface effects of acetone when used for spot (or for that
matter, general) flux removal, or when used to strip acrylic conformal coat
materials (for example: Mil--I-46058 Type AR [like Humiseal 1B31])?
                                              Marc Carter

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